Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
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Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Molybdenum click here]''' | ||
== Molybdenum deposition == | |||
Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. In [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] only VERY thin layers of Mo can be deposited. | |||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | |||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
| | |||
*12x2" wafers or | |||
*12x4" wafers or | |||
*4x6" wafers | |||
|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Layer thickness | |-style="background:WhiteSmoke; color:black" | ||
|10Å to | ! Layer thickness | ||
|10Å to 0.5 µm | |||
|10Å to 500 Å | |||
|- | |- | ||
| Deposition rate | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
| About 1 Å/s | |||
|- | |- | ||
|} | |} | ||
Revision as of 13:02, 1 March 2013
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Molybdenum deposition
Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. In PVD co-sputter/evaporation only VERY thin layers of Mo can be deposited.
| E-beam evaporation (Alcatel) | E-beam evaporation (PVD co-sputter/evaporation) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 0.5 µm | 10Å to 500 Å |
| Deposition rate | 2Å/s to 15Å/s | About 1 Å/s |