Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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*6x6" wafers or | *6x6" wafers or | ||
Revision as of 14:43, 26 September 2011
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 1000Å | 10Å to about 2000Å |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | About 1Å/s | Depending on process paramterers (see logbook) |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec