Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

@@ Line 5: / Line 5: @@
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
-! E-beam evaporation
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
 ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
@@ Line 18: / Line 19: @@
 *6x6" wafers
 |
-* wafers
+*4x6" wafers or
+*4x4" wafers or
+*2x2" wafers
+|
+*4x6" wafers or
+*4x4" wafers or
+*2x2" wafers
 |
 *24x2" wafers or
@@ Line 31: / Line 38: @@
 |RF Ar clean
 |RF Ar clean
-|  .
+|RF Ar clean
+|RF Ar clean
 |RF Ar clean
 |RF Ar clean
@@ Line 38: / Line 46: @@
 |10Å to 1µm
 |10Å to 1 µm
-|  .
+|10Å to 1000 Å
+|10Å to about 2000 Å
 |10Å to ~0.5µm (very time consuming )
 |10Å to 0.5 µm (this uses all Al in the boat)
@@ Line 45: / Line 54: @@
 |2Å/s to 15Å/s
 |10Å/s to 15Å/s
-|  .
+|About 1Å/s
+|Dependent on process parameters, but in the order of 1Å/s
 |Depending on process parameters (see [[/Sputter rates for Al|here]]), up to ~2.5 Å/s
-|~8Å/s to 15Å/s
+|~2Å/s to 15Å/s
 |-
 |}