Specific Process Knowledge/Etch/Etching of Polymer: Difference between revisions

Revision as of 13:28, 5 May 2011

Upgrading the silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards mid 2011

At the moment polymers can be etched in the plasma asher and to some extend in the RIE's. In RIE1 it is only for removing photo resist before or after a RIE etch if the plasma asher cannot be used for some reason. On RIE2 you can get allowance for some other polymer etching but you have to ask first.

Etch of Photo Resist using RIE

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-Upgrading til silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards the end of 2010.
+Upgrading the silicon etch capability at Danchip with the DRIE-Pegasus has pushed our old ASE (Advanced Silicon Etcher) out of the line so that it now only serves as backup silicon dry etcher. We have therefore decided that the ASE must be converted to a polymer etcher instead. Before releasing the tool for polymer etching it will have to be upgraded and all the 'old' silicon processes must be succesfully transfered to the new tool. We expect that this work will be completed towards mid 2011
+At the moment polymers can be etched in the plasma asher and to some extend in the RIE's. In RIE1 it is only for removing photo resist before or after a RIE etch if the plasma asher cannot be used for some reason. On RIE2 you can get allowance for some other polymer etching but you have to ask first.
 *[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of Photo Resist using RIE]]