Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/tests CHF3+H2: Difference between revisions
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|-style="background:white; color:black" | |-style="background:white; color:black" | ||
|<!-- '''Recipe name''' --> CHF3_t1 | |<!-- '''Recipe name''' --> CHF3_t1 | ||
|<!-- '''SiO2 before etch''' --> CHF<sub>3</sub>= '''22.5''' sccm <br> Coil= 800W <br> Platen= 15W <br> Press= 2.5mTorr <br> Temp= 20°C <br> | |<!-- '''SiO2 before etch''' --> CHF<sub>3</sub>= '''22.5''' sccm <br> H<sub>2</sub>= 22.5 sccm <br> Coil= 800W <br> Platen= 15W <br> Press= 2.5mTorr <br> Temp= 20°C <br> | ||
|<!--'''Process time'''--> | |<!--'''Process time'''--> | ||
|<!--'''Date'''--> | |<!--'''Date'''--> | ||
|<!--'''SEM picture'''--> | |<!--'''SEM picture'''--> | ||
|<!--'''Profile angles'''--> | |<!--'''Profile angles'''--> | ||
|<!--'''Etch rate in SiO2'''--> | |<!--'''Etch rate in SiO2'''--> | ||
|<!--'''Etch rate in resist'''--> | |<!--'''Etch rate in resist'''--> | ||
|<!--'''Selectivity (SiO2:resist)'''--> | |<!--'''Selectivity (SiO2:resist)'''--> | ||
|- | |- | ||
|- | |- | ||
|-style="background:white; color:black" | |-style="background:white; color:black" | ||
|<!-- '''Recipe name''' --> '''CHF3_t2''' | |<!-- '''Recipe name''' --> '''CHF3_t2''' | ||
|<!-- '''SiO2 before etch''' --> CHF<sub>3</sub>= 22.5 sccm <br> Coil= '''150W''' <br> Platen= '''25W''' <br> Press= 2.5mTorr <br> Temp= 20°C <br> | |<!-- '''SiO2 before etch''' --> CHF<sub>3</sub>= 22.5 sccm <br> H<sub>2</sub>= 22.5 sccm <br> Coil= '''150W''' <br> Platen= '''25W''' <br> Press= 2.5mTorr <br> Temp= 20°C <br> | ||
|<!--'''Process time'''--> | |<!--'''Process time'''--> | ||
|<!--'''Date'''--> | |<!--'''Date'''--> | ||
|<!--'''SEM picture'''--> | |<!--'''SEM picture'''--> | ||
|<!--'''Profile angles'''--> | |<!--'''Profile angles'''--> | ||
|<!--'''Etch rate in SiO2'''--> | |<!--'''Etch rate in SiO2'''--> | ||
|<!--'''Etch rate in resist'''--> | |<!--'''Etch rate in resist'''--> | ||
|<!--'''Selectivity (SiO2:resist)'''--> | |<!--'''Selectivity (SiO2:resist)'''--> | ||
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Revision as of 12:17, 14 December 2023
Recipes and results - CHF3 tests
Tests performed with AZ5214E resist:
Tests performed with 915nm UVN resist + 88nm BARC:
Recipe | Recipe parameters | Process time (min) | Date | SEM picture | Profile angles | Etch rate in SiO2 | Etch rate in resist (AZ5214E inverse) |
Selectivity (SiO2:resist) |
---|---|---|---|---|---|---|---|---|
CHF3_t1 | CHF3= 22.5 sccm H2= 22.5 sccm Coil= 800W Platen= 15W Press= 2.5mTorr Temp= 20°C |
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CHF3_t2 | CHF3= 22.5 sccm H2= 22.5 sccm Coil= 150W Platen= 25W Press= 2.5mTorr Temp= 20°C |