Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/tests CHF3+H2: Difference between revisions
Jump to navigation
Jump to search
(Created page with "===Recipes and results - <span style="background:#FFD850">CHF<sub>3</sub> tests=== {| border="1" cellspacing="1" cellpadding="1" align="left" ! '''Recipe''' ! '''Recipe parameters''' ! '''Process time''' ! '''Date''' ! '''SEM picture''' ! '''SEM pic w/ no resist''' ! '''Redeposition - top view''' ! '''Profile angles''' ! '''Etch rate in SiO2''' ! '''Etch rate in resist <br> (AZ5214E inverse)''' ! '''Selectivity <br> (SiO2:resist)''' ! '''Etch rate in Si''' |- |- |-sty...") |
|||
Line 1: | Line 1: | ||
===Recipes and results - <span style="background:#FFD850">CHF<sub>3</sub> tests=== | ===Recipes and results - <span style="background:#FFD850">CHF<sub>3</sub> tests=== | ||
Tests performed with AZ5214E resist | |||
{| border="1" cellspacing="1" cellpadding="1" align="left" | {| border="1" cellspacing="1" cellpadding="1" align="left" | ||
Line 183: | Line 184: | ||
|} | |} | ||
<br clear="all" /> | |||
Tests performed with 915nm UVN resist + 88nm BARC |
Revision as of 12:08, 14 December 2023
Recipes and results - CHF3 tests
Tests performed with AZ5214E resist
Tests performed with 915nm UVN resist + 88nm BARC