Specific Process Knowledge/Thin film deposition/Deposition of Niobium Titanium Nitride

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Deposition of Niobium Titanium Nitride

Deposition of NbTiN can be done by reactive sputtering.

The preferred tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:

• Deposition Deposition of Niobium Titanium Nitride using reactive p-DC sputtering

Comparison of LPCVD, PECVD, and sputter systems for silicon nitride deposition

	Sputter-System Metal-Nitride(PC3)	Lesker sputter system
Generel description	Reactive sputtering Pulsed DC reactive sputtering Reactive HIPIMS (high-power impulse magnetron sputtering)	*Reactive sputtering
Stoichiometry	Stoichiometric nitride, Si3N4 Silicon rich (low stress) nitride, SRN	SixNyHz SixOyNzHv Silicon nitride can be doped with boron or phosphorus	SixNy (Sputter-System Metal-Nitride(PC3)) SixOyNz (Sputter-System Metal-Oxide(PC1)) Tunable composition	Unknown
Film thickness	Stoichiometric nitride: ~5 nm - ~230 nm Silicon rich (low stress) nitride: ~5 nm - ~335 nm Thicker nitride layers can be deposited over more runs (maximum two)	~40 nm - 10 µm	limited by process time. Deposition rate likely faster than Sputter-System (Lesker)	limited by process time. Deposition rate ~ 1-5 nm/min
Process temperature	Stoichiometric nitride: 780 °C - 800 °C Silicon rich (low stress) nitride: 810 °C - 845 °C	300 °C	Up to 600 °C	Up to 400 °C
Step coverage	Good	Less good	some step coverage possible, especially by HIPIMS	some step coverage possible but amount unknown
Film quality	Deposition on both sides og the substrate Dense film Few defects	Deposition on one side of the substrate Less dense film Incorporation of hydrogen in the film	Deposition on one side of the substrate Less dense film Properties including density tunable (requires process development)	Deposition on one side of the substrate unknown quality likely O-contamination
KOH etch rate (80 oC)	Expected <1 Å/min	Dependent on recipe: ~1-10 Å/min	Unknown	Unknown
BHF etch rate	Very low (more info here)	Very high compared the LPCVD nitride (more info here)	Unknown	Unknown
Batch size	1-15 100 mm wafers (4" furnace), 1-25 100 mm wafers (6" furnace) 1-25 150 mm wafers (only 6" furnace)	Several smaller samples 1-7 50 mm wafers 1 100 mm wafers 1 150 mm wafer Depending on what PECVD you use	many smaller samples Up to 10*100 mm or 150 mm wafers	Several smaller samples 1-several 50 mm wafers 1*100 mm wafers 1*150 mm wafer
Allowed materials	Silicon Silicon oxide Silicon nitride Pure quartz (fused silica) Processed wafers have to be RCA cleaned	Silicon Silicon oxide (with boron, phosphorous) Silicon nitrides (with boron, phosphorous) Pure quartz (fused silica) III-V materials (in PECVD4) Small amount of metals (in PECVD3)	Almost any as long as they do not outgas and are not very toxic, see cross-contamination sheets	Any