Specific Process Knowledge/Thin film deposition/Deposition of Platinum

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Platinum deposition

Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

• Deposition of Platinum in Sputter System (Lesker)

	E-beam evaporation (Temescal)	E-beam evaporation (Wordentec)	Sputter deposition (Lesker)	Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3))
General description	E-beam deposition of Pt	E-beam deposition of Pt	Sputter deposition of Pt	Sputter deposition of Pt
Pre-clean	Ar ion source	none	RF Ar clean	RF Ar clean
Layer thickness	10Å - 600nm*	10Å - 600nm*	10Å - 600nm*	10Å - ? discuss with staff
Deposition rate	0.5Å/s to 10Å/s	0.5Å/s to 10Å/s	up to 3.74 Å/s	not known yet, probably similar to 'old' Lesker system
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) smaller wafers and pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	1x4" wafer or 1x6" wafer smaller pieces	Up to 10x4" or 6" wafers Many smaller pieces
Allowed materials	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals Carbon	Almost any that does not outgas
Comment

* If depositing a total of more than 600 nm, please write to metal@nanolab.dtu.dk well in advance to ensure that enough material is present.