Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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== Tin deposition == | == Tin deposition == | ||
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now ( | Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin. | ||
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Tin deposition
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.
| E-beam evaporation (Temescal) | |
|---|---|
| General description | E-beam deposition of Sn
(line-of-sight deposition) |
| Pre-clean | Ar ion clean |
| Layer thickness | 10Å to 1µm* |
| Deposition rate | 1Å/s to 10Å/s |
| Pre-clean | Ar ion bombardment |
| Batch size |
|
| Allowed materials |
|
| Comment | Tin has not yet been deposited in the Temescal to date (May 2022).
Please contact the Thin Film group if you would like us to develop the process. |
* For thicknesses above 600 nm permission is required.