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Line 14: *[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Quality_Control_(QC)|Quality Control (QC)]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes|Standard Processes]]
*[[Specific_Process_Knowledge/Lithography/Coaters/Spin_Coater:_Gamma_DUV_processing#Standard_Processes|Standard Processes]]
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"
! QC Recipe:
! (1201) DCH 150mm BARC 65nm
|-
|Substrate size
|6"
|-
|Resist volume
|3 ml
|-
|Spin-off speed
|4700 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Spin coater: Süss Stepper - BARC DUV42S-6'''
|-
|
*[http://labmanager.dtu.dk/d4Show.php?id=5123&mach=279 The QC procedure for Spin coater: Süss Stepper]<br>
*[http://labmanager.dtu.dk/view_binary.php?fileId=4212 The newest QC data for Spin coater: Süss Stepper]
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2" align="center" style="width:400px"
! QC Recipe:
! (1202) DCH 100mm BARC 65nm
|-
|Substrate size
|4"
|-
|Resist volume
|1.6 ml
|-
|Spin-off speed
|3000 rpm
|-
|Spin-off time
|30 s
|-
|Soft bake temperature
|175°C, contact
|-
|Soft bake time
|60 s
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Spin coater: Süss Stepper - BARC DUV42S-6
|-
|Nominal film thickness
|65 nm
|-
|Film thickness deviation from nominal
|<15%
|-
|Film thickness non-uniformity
|<5%
|-
|}
|-
|}
Spin-off speed will be adjusted if film thickness is outside the limit.
|}
===Standard processes===
BARC DUV42S-6 coating sequences:
*'''(1201) DCH 150mm BARC 65nm''' Dispense 3ml@1000rpm; spin-off 30s@4700rpm; softbake 60s@175°C
*'''(1202) DCH 100mm BARC 65nm''' Dispense 1.6ml@1000rpm; spin-off 30s@3000rpm; softbake 60s@175°C
KRF M230Y coating sequences:
*'''(1301) DCH 150mm M230Y 360nm''' Dispense 3ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
*'''(1302) DCH 100mm M230Y 360nm''' Dispense 1ml@1000rpm; spin-off 30s@2500rpm; softbake 90s@130°C
KRF M35G coating sequences:
*'''(1401) DCH 150mm M35G 750nm''' Dispense 3ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1402) DCH 100mm M35G 750nm''' Dispense 1ml@1000rpm; spin-off 60s@5000rpm; softbake 90s@130°C
*'''(1403) DCH 150mm M35G 1000nm''' Dispense 3ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1404) DCH 100mm M35G 1000nm''' Dispense 1ml@1000rpm; spin-off 60s@2630rpm; softbake 90s@130°C
*'''(1405) DCH 150mm M35G 1400nm''' Dispense 3ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
*'''(1406) DCH 100mm M35G 1400nm''' Dispense 1ml@1000rpm; spin-off 60s@1310rpm; softbake 90s@130°C
===Equipment performance and process related parameters===
===Equipment performance and process related parameters===
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Spin coater: Süss stepper The SÜSS Spinner-Stepper is placed in F-3 This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
Equipment info in LabManager
DUV resist overview The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.
Bottom Anti Reflection Coating (BARC):
Positive DUV resist for spin coating in 600-300nm thickness range:
Positive DUV resist for spin coating in 1600-800nm thickness range:
Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:
Equipment performance and process related parameters
Purpose
Spin coating and soft baking of BARC
Spin coating and soft baking of DUV resists
Post exposure baking
Resist
BARC DUV42S-6
Positive tone resist KRF M230Y
Positive tone resist KRF M35G
Negative tone resist UVN2300-0.8
Performance
Coating thickness
BARC DUV42S-6 60-90nm
Positive tone resist KRF M230Y 300-600nm
Positive tone resist KRF M35G 800-1600nm
Negative tone resist UVN2300-0.8 200-1400nm
Process parameters
Spin speed
10 - 5000 rpm
Spin acceleration
100 - 10000 rpm/s
Hotplate temperature
175°C for BARC baking
130°C for positive tone resist soft baking and post exposure baking
100°C for negative tone resist soft baking and post exposure baking
Substrates
Substrate size
100 mm wafers
150 mm wafers
200 mm wafers (requires tool change)
Allowed materials
Any standard cleanroom material
Batch
1 - 25
