Specific Process Knowledge/Etch/DRIE-Pegasus/DREM: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro at -19 degrees | '''1''']]
|Link2RecipeRun=[[Specific Process Knowledge/Etch/DRIE-Pegasus/DREM/DREM 2kW micro at -19 degrees | '''1''']]
}}
}}
|}
= Sandbox area below - disregard content =
{{Template:Peg2TableCColors
|TableHeader=DREM 0.2 kW v2
}}
{{Template:Peg2TableCAddrowColors
|RecipeName=DREM 0.2kW newMFC
|PriorProcessSteps= 
|Keywords= nice!
|PlatenPositionFrequency=HF      |StabilisationTime=              |StartCycleEndCycle=D/E
|DepositionTime=2.8              |EtchTime=2.6                    |NumberOfCycles=
|PressureDepDelay=              |PressureDepBoost=                |PressureDepMain=100%
|PressureEtchDelay=              |PressureEtchBoost=              |PressureEtchMain=100%
|SF6-1Dep=0.3@5                  |SF6-1Etch= 0.5@15           
|SF6-2Dep=                      |SF6-2Etch=
|O2Dep=                          |O2Etch=
|ArDep=                          |ArEtch=
|N2Dep=                          |N2Etch=
|HeDep=                          |HeEtch=
|WCoilDep=0.25                  |WCoilEtch=0.25                  |WPlatenDep=1
|WPlatenEtchDelay=0.9@1          |WPlatenEtchBoost=1@20            |WPlatenEtchMain=1
|%CoilDepLoad=40                |%CoilDepTune=50                  |%CoilEtchLoad=40                  |%CoilEtchTune=50
|%PlatenDepLoad=38.2            |%PlatenDepTune=53.8              |%PlatenEtchLoad=38.2              |%PlatenEtchTune=53.8
|Temperature=0                  |BGC-EM-EPD= 5T, NE, NE
|Link2RecipeRun=link2recipt
}}
|}
{{Template:Peg2cont1
|stepname= 0 Home matching
|generalbox=
|timebox=0 sec
|presbox=100%
|gasbox=
|RFbox= -
|matchbox= 1/1
|miscbox=
}}
==Overview of micro and nano fabrication steps - a guide to where you can find fabrication information in LabAdviser==
{| style="color: black;vertical-align:top" width="100%" border=0 cellpadding="4" cellspacing="0"
| colspan="2" |
|-
| style="width: 50%; vertical-align:top;"|
{| id="linkTable" border="1" cellpadding="0" cellspacing="0" style="text-align:center;"
! class="hideImage" style="display:none"| Front Image
! style="display:none"|-
|-
! class="hideImage" width="150" height="180px"|
! class="hideImage" width="150" | <!--Dry your sample [[file:jehanDry.png|130px|frameless  ]] -->
|-
! class="hideImage" width="150" height="180px"| <!--Thermal treatment of your sample [[file:jehanThermal.png|130px|frameless ]]-->
! class="hideImage" width="150" | Make a mask on your sample[[file:jehanmask.png|130px|frameless ]]
|-
|}
| style="color:black; width: 50%; vertical-align: top;"|
{| class="wikitable hideable hidden" border="1" cellspacing="0" cellpadding="0"  align="left" width="400px" style="float:right;"
! style="text-align:right;" | [[image:DUV6.jpg|center|400px]]
|-
|}
| style="color:black; width: 50%; vertical-align: top"|
{| class="wikitable hideable hidden" border="1" cellspacing="0" cellpadding="0"  align="left" width="430px"
! colspan="3" style="text-align:left;" |  Clean your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top" |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|7-up & Piranha
|Removes traces of organics and alkali ions
|-
|RCA
|Two step process to remove traces of organics and metals
|-
|5% HF
|Removes native oxide
|-
|IMEC
|Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Dry your sample.png|x130px|Dry your sample]] Dry your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="4" valign="top" |[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
|-
|Critial point dryer
|Sensitive wafers
|-
|Ethanol fume drying
|Sensitive wafers
|-
|N2 blow drying
|N2 pistols
|-
|}
{| class="wikitable hideable hidden"
{{Template:Peg2cont1
|stepname= 0 Home matching
|generalbox=
|timebox=90t
|presbox=7T
|gasbox=sulf
|RFbox= yes, lots
|matchbox= lit
|miscbox=na
}}
|}
{| class="wikitable hideable hidden" border="1" cellspacing="1" cellpadding="2"  align="left" width="430px"
!colspan="3" style="text-align:left;" | [[image:Make a mask on your sample.png|x100px|Make a mask on your sample]] Make a mask on your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|rowspan="5" valign="top"|[[Specific Process Knowledge/Lithography| Lithography]]
|Pattern design & Mask fabrication
|
|-
|Photolithography
|UV resists
|-
|Deep UV lithography
|DUV resists
|-
|E-beam lithography
|E-beam resists
|-
|Imprinting
|Polymers
|-
|}
|-
|}
|}

Revision as of 09:48, 1 February 2023

The DREM processes

DREM 2kW micro

DREM 2kW micro
Recipe General Pressure Gases Generators Matching Tem- pera- ture Results
C4F8 SF6 O2 Ar Coil Platen Coil Platen
Platen Stb S/E Dp Et Cyc Dp Et Dp Et Dp Et Dp Et Dp Et Dp Et Dp Et Dp Et Dp Et Runs Keywords
U/D H/L D B M D B M D B M D B M D B M D B M D B M L T L T L T L T
DREM 2kW micro Pump to base, Clamp Substrate, home platen matching unit, stabilisation 8
U HF D/E 1.2 3 100% 100% 0.3@5 0.5@50 200 0.5@100 5 0.3@200 0.5@200 15 2@15 0.3@100 200 150 150 2 2 1 1@1 1@100 1 40 50 40 50 32.5 51.9 32.5 51.9 0
DREM 2kW micro Pump to base, Clamp Substrate, home platen matching unit, stabilisation 1
U HF D/E 1.2 3 100% 100% 0.3@5 0.5@50 200 0.5@100 5 0.3@200 0.5@200 15 2@15 0.3@100 200 150 150 2 2 1 1@1 1@100 1 40 50 40 50 32.5 51.9 32.5 51.9 -19
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