Specific Process Knowledge/Thin film deposition/Deposition of Ruthenium: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Ruthenium click here]''' | |||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
== Deposition of Ru == | == Deposition of Ru == | ||
Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment: | Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment: | ||
Latest revision as of 17:06, 1 February 2023
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Deposition of Ru
Ruthenium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment:
| E-beam evaporation (Temescal) | Sputter deposition (Lesker) | |
|---|---|---|
| General description | E-beam deposition of Ru
(line-of-sight deposition) |
Sputter deposition of Ru
(not line-of-sight deposition) |
| Pre-clean | Ar ion bombardment | RF Ar clean |
| Layer thickness | 10Å to 1µm* | 10Å to 1µm** |
| Deposition rate | 0.5Å/s to 10Å/s | ~1Å/s |
| Batch size |
|
|
| Allowed materials |
|
|
| Comment | Please contact the thin film group before depositing Ru, even if Ru is in the machine.
The current target material belongs to a specific customer. |
** To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)
* To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)