Specific Process Knowledge/Thin film deposition/Sputter deposition of oxides and other compounds: Difference between revisions
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=Sputter deposition of oxides and other | =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]= | ||
=Sputter deposition of oxides= | |||
Some metal oxides are well suited for sputter deposition. Below you can compare the sputter systems available here at Nanolab for depositing them. | |||
'''This page is a collective page for metal oxides that we do not deposit by any other methods.''' Other metal oxides that may be deposited both by sputtering and other methods are described on their own individual pages (see [[Specific Process Knowledge/Thin film deposition|the thin film main page]]). | |||
Metal oxides which may be sputter deposited here at Nanolab include: | |||
==Comparison of sputter deposition options for metal oxides== | |||
= | <br clear="all" /> | ||
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;" | |||
|- | |||
|- | |||
|-style="background:silver; color:black" | |||
! | |||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]]) | |||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1)]]) | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! General description | |||
| | |||
Sputter deposition in chamber with 6 x 2" sputter guns at a slight angle to the substrate. | |||
| | |||
Sputter deposition in chamber with 6 x 3" sputter guns for metal and oxide deposition. Targets at a sligth angle to the substrate. | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
! Pre-clean | |||
|RF Ar clean | |||
|RF Ar clean | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Target (source material) size | |||
|2" | |||
|3" | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
! Power supply options | |||
| DC and RF | |||
| DC, RF, Pulsed DC, and HiPIMS | |||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Batch size | |||
| | |||
*1x4" wafer or | |||
*1x6" wafer or | |||
*several small samples | |||
| | |||
*up to 10x4" wafers or | |||
*up to 10x6" wafers | |||
*or many smaller samples | |||
|-style="background:LightGrey; color:black" | |||
! Pumping time from wafer load | |||
| | |||
Approx. 10 min | |||
| | |||
Approx. 11 min | |||
|-style="background:WhiteSmoke; color:black" | |||
! Allowed materials | |||
| | |||
*Almost any - see [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=244 cross contamination sheet] | |||
| | |||
*Almost any - see [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=441 cross contamination sheet] | |||
|-style="background:LightGrey; color:black" | |||
! Other options | |||
| | |||
Source with high-strength magnet available for magnetic oxides | |||
| | |||
Source with high-strength magnet available for magnetic oxides | |||
|-style="background:WhiteSmoke; color:black" | |||
! Comments | |||
| Has been used for many oxides with varying degrees of success. You are welcome to request your material of choice. This is our old workhorse and is a relatively dirty system but works very well for many applications. | |||
| We expect that this system will be used for many oxides. You are welcome to request your material of choice. This is our new system for larger batches and more demanding materials. It is also for normal sputtering needs to complement our old Sputter System (Lesker). | |||
|} |
Revision as of 23:43, 8 August 2020
Feedback to this page: click here
THIS PAGE IS UNDER CONSTRUCTION
Sputter deposition of oxides
Some metal oxides are well suited for sputter deposition. Below you can compare the sputter systems available here at Nanolab for depositing them.
This page is a collective page for metal oxides that we do not deposit by any other methods. Other metal oxides that may be deposited both by sputtering and other methods are described on their own individual pages (see the thin film main page).
Metal oxides which may be sputter deposited here at Nanolab include:
Comparison of sputter deposition options for metal oxides
Sputter deposition (Sputter-System (Lesker)) | Sputter deposition (Sputter-system Metal-Oxide (PC1)) | |
---|---|---|
General description |
Sputter deposition in chamber with 6 x 2" sputter guns at a slight angle to the substrate. |
Sputter deposition in chamber with 6 x 3" sputter guns for metal and oxide deposition. Targets at a sligth angle to the substrate. |
Pre-clean | RF Ar clean | RF Ar clean |
Target (source material) size | 2" | 3" |
Power supply options | DC and RF | DC, RF, Pulsed DC, and HiPIMS |
Batch size |
|
|
Pumping time from wafer load |
Approx. 10 min |
Approx. 11 min |
Allowed materials |
|
|
Other options |
Source with high-strength magnet available for magnetic oxides |
Source with high-strength magnet available for magnetic oxides |
Comments | Has been used for many oxides with varying degrees of success. You are welcome to request your material of choice. This is our old workhorse and is a relatively dirty system but works very well for many applications. | We expect that this system will be used for many oxides. You are welcome to request your material of choice. This is our new system for larger batches and more demanding materials. It is also for normal sputtering needs to complement our old Sputter System (Lesker). |