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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Nickel click here]'''


== Nickel deposition ==
== Nickel deposition ==
Nickel can be deposited by e-beam evaporation or electroplating. In the chart below you can compare the different deposition equipment.
Nickel can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipment.


*[[/Electroplating of nickel|Electroplating of nickel]]
*[[/Electroplating of nickel|Electroplating of nickel]]
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|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|10 Å to 5000 Å **
|~20 µm to ~1000 µm
|~ 20 µm to ~ 1000 µm
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"


! Deposition rate
! Deposition rate
|2Å/s to 10Å/s
|2-10 Å/s
|10Å/s to 15Å/s
|10-15 Å/s
|1 to 10Å/s
|1-10 Å/s
|Depends on process parameters. About 1 Å/s  
|Depends on process parameters, about 1 Å/s  
|Depends on process parameters.
|Depends on process parameters
|About 10 Å/s to 250 Å/s
|~ 10-250 Å/s


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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* Metals  
* Metals  
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*Almost any that do not outgas if you plan to use substrate heating. Check the cross-contamination sheets in Labmanager.
*Almost any that do not outgas. Check the cross-contamination sheets in Labmanager.
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|
Base materials:<br>
Base materials:<br>
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Comment
! Comment
| Thicknesses above 2000 Å requires special permission
|  
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*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].  
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].  
*Thicknesses above 2000 Å  requires special permission
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*May use high-strength magnet for deposition.  
*May use high-strength magnet for deposition.  
*Thicknesses above 2000 Å require special permission
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*May use high-strength magnet for deposition
*May use high-strength magnet for deposition
*Thicknesses above 2000 Å require special permission
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|Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary.
*Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary.
|-
|-


|}
|}


'''*''' ''To deposit layers thicker than 600 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine''
'''*''' ''To deposit a cumulative thickness above 600 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine''




'''**''' ''To deposit layers thicker than 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine''
'''**''' ''To deposit a cumulative thickness above 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine''
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