Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
→Nickel deposition: added cluster sputterer |
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*Thicknesses above 2000 Å requires special permission | *Thicknesses above 2000 Å requires special permission | ||
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| | |May use high-strength magnet for deposition | ||
|May use high-strength magnet for deposition | |May use high-strength magnet for deposition | ||
|Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | |Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | ||