Specific Process Knowledge/Thin film deposition/Deposition of Copper

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Deposition of Cu

Copper can be deposited by e-beam evaporation or sputtering at Nanolab. In the chart below you can compare the different deposition equipment.

Here are some results of studies on Cu deposition processes:

Roughness of Cu layers - Roughness of Cu layers deposited with the Alcatel e-beam evaporator

Stress in sputtered Cu - Low stress in Cu films sputtered with the Sputter-System (Lesker)

	E-beam evaporation (Temescal)	Sputter deposition (Lesker)
General description	E-beam deposition of Cu (line-of-sight deposition)	Sputter deposition of Cu (not line-of-sight deposition)
Pre-clean	Ar ion bombardment	RF Ar clean
Layer thickness	10Å to 1µm*	10Å to 1µm**
Deposition rate	1Å/s to 10Å/s	~1Å/s
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) smaller pieces	smaller pieces Up to 1x6" wafers
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals
Comment	As of March 2020, Cu has not yet been deposited in this machine. Please contact the Thin Film group to develop a process.

** To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)

* To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@nanolab.dtu.dk)