LabAdviser/314/Preparation 314-307/Solid-matter/FIB-lamella: Difference between revisions
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=FIB lamella preparation= | =FIB lamella preparation= | ||
The main goal of the lift out process is to extract a small piece of a bulk like sample (typical | |||
SEM sample) and attach it to a grid suitable for TEM imaging. The desired sample outcome is a lamella thin enough to be suited for TEM/STEM/EELS/EDX measurements (<100nm is desirable). Throughout this document it is assumed that the operator is an experienced SEM user, always works at eucentric height (the crossover of the ion and electron beam) and has an understanding of the chamber geometry. Furthermore, all settings are material and sample dependent. As a rule of thumb, the harder a material is the more difficult it is to mill with the ion beam. As an example, 20nA is on the low end for milling larger sections of corundum efficiently but 2.8nA is almost too aggressive for gold. | |||
== 1,2: Protective Pt deposition == | |||
(Anton Bay Andersen, March 2020) | (Anton Bay Andersen, March 2020) | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/314/Preparation_314-307/Solid-matter/FIB-lamella click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/314/Preparation_314-307/Solid-matter/FIB-lamella click here]''' | ||
Revision as of 13:14, 25 March 2020
FIB lamella preparation
FIB lamella preparation
The main goal of the lift out process is to extract a small piece of a bulk like sample (typical SEM sample) and attach it to a grid suitable for TEM imaging. The desired sample outcome is a lamella thin enough to be suited for TEM/STEM/EELS/EDX measurements (<100nm is desirable). Throughout this document it is assumed that the operator is an experienced SEM user, always works at eucentric height (the crossover of the ion and electron beam) and has an understanding of the chamber geometry. Furthermore, all settings are material and sample dependent. As a rule of thumb, the harder a material is the more difficult it is to mill with the ion beam. As an example, 20nA is on the low end for milling larger sections of corundum efficiently but 2.8nA is almost too aggressive for gold.
1,2: Protective Pt deposition
(Anton Bay Andersen, March 2020)
Feedback to this page: click here