Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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* [[/Deposition of Silver in Thermal Evaporator|Thermal deposition of Silver in the Thermal Evaporator]] | * [[/Deposition of Silver in Thermal Evaporator|Thermal deposition of Silver in the Thermal Evaporator]] | ||
==Comparison of deposition equipment for silver== | |||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process_information | |||
|Cluster-based sputter system]]) | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
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| Thermal deposition of Ag | | Thermal deposition of Ag | ||
| E-beam deposition of Ag | | E-beam deposition of Ag | ||
| Sputter deposition of Ag | |||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
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| RF Ar clean | | RF Ar clean | ||
| none | | none | ||
| RF Ar clean | |||
| RF Ar clean | | RF Ar clean | ||
| RF Ar clean | | RF Ar clean | ||
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|10Å to 2000Å | |10Å to 2000Å | ||
|10Å to about 3000Å | |10Å to about 3000Å | ||
|10Å to about | |10Å to about 2000Å | ||
|10Å to ? | |||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
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|1 to 10Å/s | |1 to 10Å/s | ||
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | |Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook). | ||
|Dependent on process parameters. | |||
|Dependent on process parameters. | |Dependent on process parameters. | ||
|- | |- | ||
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*1x4" wafers or | *1x4" wafers or | ||
*smaller pieces | *smaller pieces | ||
| | |||
*up to 10x6" wafers or | |||
*up to 10x4" wafers or | |||
*many smaller pieces | |||
|-style="background:Lightgrey; color:black" | |-style="background:Lightgrey; color:black" | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
| | |||
*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager. | |||
|-style="background:whitesmoke; color:black" | |-style="background:whitesmoke; color:black" | ||
! Comment | ! Comment | ||
| Pumpdown approx 20 min. Possible to tilt the wafer. | | Pumpdown approx 20 min. Possible to tilt the wafer. | ||
| Pumpdown approx | | Pumpdown approx 15 min. | ||
| Only very thin layers. Pumpdown approx 1 hour. | | Only very thin layers. Pumpdown approx 1 hour. | ||
| | | | ||
| | | | ||
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|Load and transfer approx. 12 minutes | |||
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|} | |} | ||