Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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Base materials:<br> | Base materials:<br> | ||
*Silicon | *Silicon | ||
*Polymers with Tg > | *Polymers with Tg > 75°C | ||
*Cross-linked or hard baked resists supported by one of the above | *Metals (bulk) | ||
*Cross-linked or hard baked resists supported by one of the above mentioned materials | |||
Seed metals:<br> | Seed metals:<br> | ||
* NiV (75 - 100 nm recommended) | * NiV (75 - 100 nm recommended) | ||