Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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== Tin deposition == | == Tin deposition == | ||
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in | Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in the Temescal, which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin. | ||
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Revision as of 13:29, 3 October 2021
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Tin deposition
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in the Temescal, which we have now (September 2021). Please contact the Thin Film group if you would like to deposit tin.
| E-beam evaporation (Temescal) | |
|---|---|
| General description | E-beam deposition of Sn
(line-of-sight deposition) |
| Pre-clean | Ar ion clean |
| Layer thickness | 10Å to 1µm* |
| Deposition rate | 1Å/s to 10Å/s |
| Pre-clean | Ar ion bombardment |
| Batch size |
|
| Allowed materials |
|
| Comment | Tin has not yet been deposited in the Temescal to date (August 2018).
Please contact the Thin Film group if you would like us to develop the process. |
* For thicknesses above 600 nm permission is required.