Specific Process Knowledge/Etch: Difference between revisions
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== Choose a dry etch equipment == | == Choose a dry etch equipment == | ||
*[[RIE (Reactive Ion Etch)]] | *[[/RIE (Reactive Ion Etch)|RIE (Reactive Ion Etch)]] | ||
*[[ASE (Advanced Silicon Etch)]] | *[[/ASE (Advanced Silicon Etch)|ASE (Advanced Silicon Etch)]] | ||
*[[AOE (Advanced Oxide Etch)]] | *[[/AOE (Advanced Oxide Etch)|AOE (Advanced Oxide Etch)]] | ||
== Choose a wet etch == | == Choose a wet etch == | ||
Revision as of 12:05, 17 October 2007
Choose material to be etched
- Aluminium
- Chromium
- Titanium
- Gold
- Platin
- Polymer
- Silicon
- Silicon Nitride
- Silicon Oxide
- Bulk Glass - Borofloat (pyrex) and fused silica (quartz)
Choose a dry etch equipment
Choose a wet etch
- Wet Silicon Nitride Etch
- Wet Silicon Oxide Etch (BHF)
- KOH Etch - Anisotropic silicon etch
- Wet Polysilicon Etch - Isotropic silicon etch
- Wet Aluminium Etch