LabAdviser/Courses

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Courses

We are building up a number of courses to educate our users in using the cleanroom facility and the equipment inside. Below you can see the courses that are presently running. The "Cleanroom introduction Course" is mandatory for all users that need to enter the cleanroom facility on their own. Then there is a number of TPT's (Tool Package Training Courses) that you need to attend depending on which kind of tool you need to use inside the facility.

The Cleanroom Introduction Course

For information regarding the Introduction Course, please take a look at the DTU Danchip homepage, a direct link is given here: [1]

The Lithography TPT

DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.

The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.

Lithography Tool Package Training
Schedule	Theoretical part The lecture has been replaced by videos that can be viewed at one's leisure. A 1 hour "questions and exercises" session once or twice a month will be planned as needed (typically Fridays 09:30-10:30). NEXT "questions and exercises" sessions: 31st of March, 21st of April, 28th of April, 19th of May Practical part A 4-5 hour training session 2-3 times a month, max. 4 persons per session (typically Wednesdays 09:00 - 14:00). NEXT training sessions: 5th of April, 26th of April, 3rd of May, 24th of May
Location	Theoretical part The location of the "questions and exercises" session will be specified after signing up for the course. Practical part The training session takes place inside the cleanroom. The meeting point will be in front of the first equipment.
Qualified Prerequisites	Cleanroom safety course at DTU Danchip Admission to the cleanroom must be obtained before the training session
Preparations	Before the "questions and exercises" session Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus) Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos. Before training session Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic). Study the equipment manuals. The manuals are available in LabManager. Study the TPT process flows (first print, and alignment). Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the section below.
Course Responsible	The Lithography Group at DTU Danchip. Sign up for the course by e-mailing to lithography@danchip.dtu.dk.
Learning Objectives	Describe fundamental parts of lithographic processing in a cleanroom, design of process flows Authorization to use spin coater, mask aligner, and developer at DTU Danchip Calculate relevant process parameters Analyze and apply your results of lithographic processing

Material for preparations and further information

Literature Franssila, 2010, Chapter 9: Optical Lithography Franssila, 2010, Chapter 10: Advanced Lithography Lithography Troubleshooter from MicroChemicals Application Notes from MicroChemicals Lecture videos Lecture videos (7 videos, 2:41 hours in total) Slides from Lecture TPT slides: Introduction TPT slides: Spin Coating TPT slides: UV Exposure TPT slides: Development TPT slides: Post-processing TPT slides: Process Effects and Examples	Training videos Training Video: Automatic Spin Coater Training Video: UV Mask Aligner Part I (Operation) Training Video: UV Mask Aligner Part II (Alignment) Training Video: Automatic Puddle Developer Manuals Automatic Spin Coater: Spin Coater: Gamma UV UV Mask Aligner: Aligner: MA6 - 2 or KS Aligner Automatic Puddle Developer: Developer: TMAH UV-lithography Process Flows TPT first print process flow TPT alignment process flow

The Dry Etch TPT

DTU Danchip offers a Tool Package Training in Dry etching; the course includes theory on dry etching and equipment, as well as training in equipment operation in the cleanroom.

The course is for all users that intend to perform any kind of plasma dry etching in the cleanroom, and is a prerequisite for training in any of the plasma dry etch equipment's.

Dry Etch Tool Package Training
Schedule	Theoretical part The next 3 hour lecture is on the 28th of Marts from 9:00 to approximately 12. Practical part A 2-3 hour training session, max. 3 persons per session will be planed after the lecture
Location	Theoretical part The location of the lecture will be notified after you have signed up Practical part The training session takes place inside the cleanroom. The meeting point will be in The gauning area
Qualified Prerequisites	Cleanroom safety course at DTU Danchip Admission to the cleanroom must be obtained before the training session
Preparations	Before the lecture Watch the video:Introduction to Dry Etch Equipment Before training session Watch the training video: of spin coating (automatic), exposure (operation, and alignment), and development (automatic). Watch the screen cast video's for the ASE/AOE software:See below Watch the screen cast video's for the DRIE/ICP meat and III-V ICP: See below
Course Responsible	The Dry Etch Group at DTU Danchip. Sign up for the course by e-mailing to dryetch@danchip.dtu.dk.
Learning Objectives	Know why and when to use dry etching Use the dry etchers without harming the machines Select the right instrument to use for his/her dry etch processing Select an appropriate etch recipe for his/her dry etch processing Spot when the recipe needs to be tuned for his/her needs and Suggest relevant tuning parameters

Material for preparations and further information

Literature Pre Lecture video Slides from Lecture TPT slides: Introduction TPT slides: Spin Coating TPT slides: UV Exposure TPT slides: Development TPT slides: Post-processing TPT slides: Process Effects and Examples	Pre hands-on training videos Screen cast videos for the DRIE, ICP metal and III-V ICP: Overview Running processes Recipes The Bosch Processes Automatic processing at the DRIE-Pegasus Screen cast videos for the ASE and AOE: Intro Load and Transfer Recipe Editor The Bosch Process Run a Process Removing a Wafer from the Load Lock The Process Log] Manuals Automatic Spin Coater: Spin Coater: Gamma UV Manual Spin Coater: Spin Coater: Manual Standard Resists UV Mask Aligner: Aligner: MA6 - 2 or KS Aligner Automatic Puddle Developer: Developer: TMAH UV-lithography Manual Puddle Developer: Developer: TMAH Manual Process Flows TPT first print process flow TPT alignment process flow