Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions
| Line 27: | Line 27: | ||
; Substrate temperature | ; Substrate temperature | ||
: The temperature of the substrate is the same as the process chamber and it is kept constant at 35 | : The temperature of the substrate is the same as the process chamber and it is kept constant at 35 <sup>o</sup>C. | ||
; | ; Vapor order | ||
: The | : There is no active force that injects the chemicals into the process chamber. The driving force is a combination of two factors: | ||
* '''A pressure gradient''' The vapor pressure of the chemical (when stored at some temperature in the cylinder) compared to the pressure in the chamber. | |||
* '''A temperature gradient''' The chemical and the line that feeds the process chamber are kept at a higher temperature. | |||
== The FLAT recipe == | |||
The FLAT recipe is designed to coat non-structured wafers. | |||