Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
| Line 10: | Line 10: | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
| E-beam deposition of Mo | | E-beam deposition of Mo | ||
| Sputter deposition of Mo | | Sputter deposition of Mo | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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! Layer thickness | ! Layer thickness | ||
|10Å to 0.5 µm* | |10Å to 0.5 µm* | ||
|10Å to 500 Å | |10Å to 500 Å | ||
|- | |- | ||
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! Deposition rate | ! Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
| Depends on process parameters, roughly about 1 Å/s | | Depends on process parameters, roughly about 1 Å/s | ||
|- | |- | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
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* Pieces or | * Pieces or | ||
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* SU-8 | * SU-8 | ||
* Metals | * Metals | ||
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* Silicon | * Silicon | ||
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! Comment | ! Comment | ||
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Revision as of 10:17, 19 September 2016
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Molybdenum deposition
Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | Sputter deposition (Lesker) | |
|---|---|---|
| General description | E-beam deposition of Mo | Sputter deposition of Mo |
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 0.5 µm* | 10Å to 500 Å |
| Deposition rate | 2Å/s to 15Å/s | Depends on process parameters, roughly about 1 Å/s |
| Batch size |
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| Allowed materials |
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| Comment |
* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.