Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
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| E-beam deposition of Ag | | E-beam deposition of Ag | ||
| Thermal deposition of Ag | | Thermal deposition of Ag | ||
| E-beam deposition of Ag | | E-beam deposition of Ag | ||
| Sputter deposition of Ag | | Sputter deposition of Ag | ||
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! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|10Å to 1µm* | |10Å to 1µm* | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|10Å to 2000Å | |10Å to 2000Å | ||
|10Å to about 5000Å | |10Å to about 5000Å | ||
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 10 Å/s | |1Å/s to 10 Å/s | ||
|1 to 10Å/s | |1 to 10Å/s | ||
|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]]. | |Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]]. | ||
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*6x4" wafers or | *6x4" wafers or | ||
*24x2" wafers | *24x2" wafers | ||
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*4x6" wafers or | *4x6" wafers or | ||
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|-style="background:Lightgrey; color:black" | |-style="background:Lightgrey; color:black" | ||
!Allowed materials | !Allowed materials | ||
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* Silicon | * Silicon | ||
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|Only very thin layers. | |Only very thin layers. | ||
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Revision as of 08:37, 19 September 2016
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Deposition of Silver
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
Sputter deposition of Silver
Thermal deposition of Silver
E-beam evaporation (Alcatel) | Thermal evaporation (Wordentec) | E-beam evaporation (Physimeca) | Sputter evaporation (PVD co-sputter/evaporation) | Sputter evaporation (Wordentec) | Sputter deposition (Lesker) | E-beam evaporation (III-V Dielectric evaporator) | |
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General description | E-beam deposition of Ag | Thermal deposition of Ag | E-beam deposition of Ag | Sputter deposition of Ag | Sputter deposition of Ag | Sputter deposition of Ag | E-beam deposition of Ag |
Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean | ||
Layer thickness | 10Å to 1µm* | 10Å to 0.5µm (0.5µm not on all wafers) | 10Å to 2000Å | 10Å to about 5000Å | 10Å to about 3000Å | 10Å to about 1000Å | 10Å to about 1000Å |
Deposition rate | 2Å/s to 15Å/s | 1Å/s to 10 Å/s | 1 to 10Å/s | Dependent on process parameters. | Depending on process parameters (also written in the logbook). | Dependent on process parameters. | 2 Å/s to 5 Å/s |
Batch size |
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Allowed materials |
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Comment | Only very thin layers. |
* For thicknesses above 200 nm permission is required.