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Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions

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== Deposition of Cu ==
== Deposition of Cu ==
Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipments.
Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipments.
==Deposition of Copper using sputter deposition technique==
* [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|Sputtering of Cu in PVD co-sputter/evaporation]]