Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment. | ||
== Adhesion of Au on Si == | |||
The adhesion of Au on Si is not very good, and an adhesionlayer is often deposited on the wafer, before the Au layer evaporated. A good metal to use as adhesionlayer is Ti, but Cr is also often used. | |||
The most commonly used thickness of the Ti adhesionlayer is 10 nm. Also thinner layers, for example 5 nm, can be used. | |||
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'''*''' ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.'' | '''*''' ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.'' | ||
== Studies of Au deposition processes in the Wordentec== | == Studies of Au deposition processes in the Wordentec== | ||