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===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
===The section below here is under construction [[Image:section under construction.jpg|70px]] ===
==Overview of sample processing 3==
{| {{Table}}
|- valign="top"
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Clean your sample.png|x100px|Clean your sample]] <br/> Clean your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]]
|Soap Sonic
|Removes dust and particles
|-
|
|7-up & Piranha
|Removes organics and alkali ions
|-
|
|RCA
|Two step process to remove organics and metals
|-
|
|5% HF
|Removes native oxide
|-
|
|IMEC
|Removing dust, organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|-
|}
|
{| class="collapsible wikitable collapsed" border="1" cellspacing="1" cellpadding="2"  align="right"
! [[image:Dry your sample.png|x100px|Dry your sample]] <br/> Dry your sample
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Wafer and sample drying|Wafer and sample drying]]
|Spin dryers
|Whole wafers
|-
|
|Critial point dryer
|Sensitive wafers
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Create a film on your sample.png|thumb|100px|Create a layer/film on your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process/Oxidation| Thermal Process/Oxidation]]
|Thermal oxidation
|Thermal SiO2
|-
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]]
|
|
|-
|
|Sputter deposition
|Si,SiO2,Si3N3,TiO2, metals
|-
|
|Thermal evaporation
|Al, ?
|-
|
|E-beam evaporation
|Metals
|-
|
|LPCVD
|Si3N4, SRN, SiO2, Si (poly and amorph)
|-
|
|PECVD
|Si3N4, SiO2, PBSG
|-
|
|Electroplating
|Ni
|-
|[[Specific Process Knowledge/Lithography/Coaters|Lithography/Coaters]]
|
|
|-
|
|Spin coating
|resists, polymers
|-
|
|Spray coating
|resists, polymers
|-
|Epitaxial growth
|MOCVD
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Dope your sample.png|thumb|100px|Dope your sample]]
|-
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thin film deposition/PECVD| Thin film deposition/PECVD]]
|PECVD
|Deposition of SiO2 or Si3N4 doped with P,B and Ge
|-
|[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD PolySilicon|Thin film deposition/Furnace LPCVD PolySilicon]]
|LPCVD
|Deposition of PolySi doped with B or P
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Boron|Thermal Process/Dope with Boron]]
|Predeposition and drive-in
|Doping Silicon wafers with boron
|-
|[[Specific Process Knowledge/Thermal Process/Dope with Phosphorus|Thermal Process/Dope with Phosphorus]]
|Predeposition and drive-in
|Doping Silicon wafers with phosphorus
|-
|[[Specific Process Knowledge/Doping|Doping]]
|Ion implant
|?
|-
|}
|-
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Thermal treat your sample.png|thumb|100px|Thermal treatment of your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Thermal Process|Thermal Process]]
|Annealing
|Si, PECVD layers
|-
|
|Oxidation
|Si wafers
|-
|
|Doping with B/P
|Si wafers
|-
|
|Pyrolysis
|Resists?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Make a mask on your sample.png|thumb|100px|Make a mask on your sample]]
|-
!Entry page in LabAdviser
!Techniques
|-
|[[Specific Process Knowledge/Lithography| Lithography]]
|
|-
|
|Photolithography
|-
|
|Deep UV lithography
|-
|
|E-beam lithography
|-
|
|Imprinting
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Transfer mask pattrn to your sample.png|thumb|100px|Transfer mask pattern to your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|[[Specific Process Knowledge/Etch| Etch]]
|
|
|-
|
|Wet etch
|Si,Glass,SiO2,Si3N4,Al,Cr,Ti,Au,Pt,InP,InGaAsP,GaAs/AlGaAs
|-
|
|Dry etch
|Any material
|-
|[[Specific Process Knowledge/Lithography/LiftOff| Lift-off]]
|
|?
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Define your structure directly.png|thumb|100px|Define your structure directly to your sample]]
|-
|Imprinting
|-
|LASER machining
|-
|Lithographic definition
|-
|Polymer Injection molding
|-
|}
|-
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Bond your samples together.png|thumb|100px|Bond your samples together]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|}
|
{| class="wikitable collapsible" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Characterize your sample.png|thumb|100px|Characterize your sample]]
|-
!Entry page in LabAdviser
!Techniques
!Materials
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|
|
|
|-
|}
|
{| class="wikitable collapsible collapsed" border="1" cellspacing="1" cellpadding="2"  align="left"
! [[image:Pack your sample (back-end).png|thumb|100px|Pack your sample (back-end)]]
|-
|Chip/die mounting
|-
|Wire bonding
|-
|Dicing
|-
|}
|
|-
|}

Revision as of 10:45, 25 February 2015

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