Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
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Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) | ||
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!Etch rate | |||
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~40-100 nm/min | ~40-100 nm/min | ||
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1-25 wafer at a time | 1-25 wafer at a time | ||
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!Size of substrate | |||
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4" wafers | 4" wafers |
Revision as of 12:55, 31 January 2008
Etching of Chromium
Etching of chromium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- HNO:HO:cerisulphate - 90ml:1200ml:15g - standard at Danchip
- Commercial chromium etch
Etch rate are depending on the level of oxidation of the metal.
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Chemical solution | HNO:HO:cerisulphate - 90ml:1200ml:15g | Commercial chromium etch
CE 8002-A |
Process temperature | Room temperature | Room temperature |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~40-100 nm/min |
~10-20 nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
No restrictions. Make a note on the beaker of which materials have been processed. |
No restrictions. Make a note on the beaker of which materials have been processed. |