Specific Process Knowledge/Etch/Etching of Gold: Difference between revisions
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Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions: | Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions: | ||
# Iodine etch: KI:I<math>_2</math>:H<math>_2</math>O - 100g:25g:500ml | # Iodine etch: KI:I<math>_2</math>:H<math>_2</math>O - 100g:25g:500ml - standard at Danchip | ||
# Aqua Regia (Kongevand): HNO<math>_3</math>:HCl - 1:3 | # Aqua Regia (Kongevand): HNO<math>_3</math>:HCl - 1:3 | ||
Revision as of 09:58, 31 January 2008
Etching of Gold
Etching of Gold is done wet at Danchip making your own set up in a beaker in the fumehood. We have two different solutions:
- Iodine etch: KI:I:HO - 100g:25g:500ml - standard at Danchip
- Aqua Regia (Kongevand): HNO:HCl - 1:3
Comparing the two solutions
| Iodine based gold etch | Aqua Regia (Kongevand) | |
|---|---|---|
| General description |
Etch of pure Gold |
Etch of pure Gold |
| Chemical solution | KJ:J:HO (100g:25g:500ml) | HCl:HNO (3:1) |
| Process temperature | 20 oC | 20 oC |
| Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Unmasked - used as a stripper |
| Etch rate |
~100 nm/min |
~(??) nm/min |
| Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
| Size of substrate |
2-6" wafers |
2-6" wafers |