Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

Knil (talk | contribs)
No edit summary
Bghe (talk | contribs)
No edit summary
Line 5: Line 5:


*[[/Electroplating of nickel|Electroplating of nickel]]
*[[/Electroplating of nickel|Electroplating of nickel]]
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].




Line 161: Line 162:


'''*''' ''To deposit layers thicker then 2000 Å permission is required (contact Thin film group)''
'''*''' ''To deposit layers thicker then 2000 Å permission is required (contact Thin film group)''
== Stress in Nickel films ==
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]].