Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions
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The settings saved in the material file for thermal aluminum are these: | The settings saved in the material file for thermal aluminum are these: | ||
Soak power 1: 5% | Soak power 1: 5% | ||
Soak power 2: 7% | Soak power 2: 7% | ||
These are already saved in the process. | These are already saved in the process. | ||
Revision as of 11:09, 16 October 2014
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Thermal evaporation of Aluminum
Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.
Recipe
Use process 9 in Wordentec to deposit thermal Aluminum.
Observe: you need to be specially trained to use the thermal deposition source.
Set up
Program settings
The settings saved in the material file for thermal aluminum are these:
Soak power 1: 5%
Soak power 2: 7%
These are already saved in the process.