Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

@@ Line 12: / Line 12: @@
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
 |-
 |-style="background:WhiteSmoke; color:black"
 ! General description
+|E-beam deposition of Pt
 |E-beam deposition of Pt
 |E-beam deposition of Pt
@@ Line 25: / Line 27: @@
 |RF Ar clean
 |RF Ar clean
+|
 |RF Ar clean
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 |10Å to 5000Å*
 |10Å to 5000Å*
+|10Å to 2000Å
 |10Å to 5000Å
 |-
@@ Line 38: / Line 42: @@
 |2Å/s to 15Å/s
 |10Å/s to 15Å/s
+|10Å/s
 |? Å/s to ? Å/s
 |-
@@ Line 49: / Line 54: @@
 *6x4" wafers or
 *6x6" wafers
+|
+*1x 2" wafer or
+*1x 4" wafers or
+*Several smaller pieces
 |
 *1x4" wafer or
@@ Line 77: / Line 86: @@
 * SU-8
 * Metals
+|
+* III-V materials
+* Silicon wafers
+* Quartz wafers
+* Pyrex wafers
 |
 * Silicon
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 |-style="background:WhiteSmoke; color:black"
 ! Comment
+|
 |
 |