Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	Sputter deposition (Lesker)
General description	E-beam deposition of Pt	E-beam deposition of Pt	Sputter deposition of Pt
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 5000Å*	10Å to 5000Å*	10Å to 5000Å
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	? Å/s to ? Å/s
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	1x4" wafer or 1x6" wafer smaller pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals Carbon
Comment

* For thicknesses above 200 nm permission is required from Thin Film group.

Revision as of 09:20, 26 March 2014 view source Knil (talk \| contribs) DCH-Employees-701 420 edits No edit summary ← Older edit		Revision as of 09:20, 26 March 2014 view source Knil (talk \| contribs) DCH-Employees-701 420 edits No edit summary Newer edit →
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	==Platinum deposition ==		==Platinum deposition ==

	Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.		Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.