Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
| Line 4: | Line 4: | ||
== Deposition of Cu == | == Deposition of Cu == | ||
Copper can be deposited by e-beam evaporation or sputtering . In the chart below you can compare the different deposition equipment. | Copper can be deposited by e-beam evaporation or sputtering . In the chart below you can compare the different deposition equipment. | ||
==Deposition of Copper using sputter deposition technique== | |||
* [[Specific Process Knowledge/Thin film deposition/Multisource PVD/Cu|Sputtering of Cu in PVD co-sputter/evaporation]] | |||