Specific Process Knowledge/Thin film deposition/Deposition of Titanium Oxide: Difference between revisions
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*Can probably be varied (sputter target: Ti, O2 added during deposition) | *Can probably be varied (sputter target: Ti, O2 added during deposition) | ||
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* | * | ||
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!Deposition rate | !Deposition rate | ||
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*3.0-3.5nm/min | *3.0-3.5nm/min | ||
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* | * | ||