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Specific Process Knowledge/Thin film deposition/Deposition of Titanium Oxide: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
Line 93: Line 93:
!Stoichiometry
!Stoichiometry
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Can probably be varied (sputter target: Ti, O2 added during deposition)
*Can probably be varied (sputter target: Ti, O2 added during deposition)
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*A
*A
Line 109: Line 109:
!Deposition rate
!Deposition rate
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*A
*3.0-3.5nm/min ± ?
*B
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*A
*
*B
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|-


Line 120: Line 118:
!Step coverage
!Step coverage
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*A
*Not Known
*B
*C
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*A
*
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|-


Line 130: Line 126:
!Process Temperature
!Process Temperature
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*A
*Expected to be below 100<sup>o</sup>C
*B
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*A
*
*B
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|-


Line 141: Line 135:
!More info on TiO2
!More info on TiO2
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*A
*[[/IBSD of TiO2|TiO2 made on IBE/IBSD Ionfab300]]
*B
*C
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*A
*
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|-


Line 154: Line 146:
!Substrate size
!Substrate size
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*<nowiki>#</nowiki> small samples
*1 50mm wafer
*<nowiki>#</nowiki> 50 mm wafers
*1 100mm wafer
*<nowiki>#</nowiki> 100 mm wafers
*1 150mm wafer
*<nowiki>#</nowiki> 150 mm wafers
*1 200mm wafer
*Smaller pieces can be mounted with capton tape
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*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> small samples
Line 169: Line 162:
!'''Allowed materials'''
!'''Allowed materials'''
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*Allowed material 1
*Almost any materials
*Allowed material 2
*not Pb and very poisonous materials
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*Allowed material 1  
*Allowed material 1  
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