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Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

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! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])


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|-  
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! Layer thickness
! Layer thickness
|10Å to 1µm  
|10Å to 1µm*
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 1000Å  
|10Å to 1000Å  
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!Allowed materials
!Allowed materials
|
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
|
* Silicon
* Silicon oxide  
* Silicon oxide  
* Silicon (oxy)nitride  
* Silicon (oxy)nitride  
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|}
|}


'''*''' ''For thicknesses above 200 nm permission is requested.''


[[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec''
[[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec''