Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
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! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | ||
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
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! Layer thickness | ! Layer thickness | ||
|10Å to 1µm | |10Å to 1µm* | ||
|10Å to 0.5µm (0.5µm not on all wafers) | |10Å to 0.5µm (0.5µm not on all wafers) | ||
|10Å to 1000Å | |10Å to 1000Å | ||
| Line 76: | Line 75: | ||
!Allowed materials | !Allowed materials | ||
| | | | ||
* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | |||
* Silicon | |||
* Silicon oxide | * Silicon oxide | ||
* Silicon (oxy)nitride | * Silicon (oxy)nitride | ||
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|} | |} | ||
'''*''' ''For thicknesses above 200 nm permission is requested.'' | |||
[[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec'' | [[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec'' | ||