Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions

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Molybdenum deposition

Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. In PVD co-sputter/evaporation only VERY thin layers of Mo can be deposited.

	E-beam evaporation (Alcatel)	E-beam evaporation (PVD co-sputter/evaporation)
General description	E-beam deposition of Mo	E-beam deposition of Mo
Pre-clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 0.5 µm*	10Å to 500 Å
Deposition rate	2Å/s to 15Å/s	About 1 Å/s
Batch size	Up to 1x4" wafers smaller pieces	12x2" wafers or 12x4" wafers or 4x6" wafers
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8
Comment		Only very thin layers (up to 100nm).

* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

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-! Batch size
+! General description
-|
+| E-beam deposition of Mo
-*Up to 1x4" wafers
+| E-beam deposition of Mo
-*smaller pieces
-|
-*12x2" wafers or
-*12x4" wafers or
-*4x6" wafers
 |-
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 |-
 |-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
+|-
+|-style="background:LightGrey; color:black"
-|-style="background:WhiteSmoke; color:black"
 !Allowed materials
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 * Mylar
 * SU-8
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comment
 |