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Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

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! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]])
! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]])
|-  
|-  
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"


! Batch size
! General description
|
|E-beam deposition of Nickel
*Up to 1x4" wafers
|E-beam deposition of Nickel
*smaller pieces
|E-beam deposition of Nickel
|
|Electroplating of Nickel
*24x2" wafers or
|-
*6x4" wafers or
 
*6x6" wafers
|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*1x2" wafer or
*1x4" wafer or
*1x6" wafer


|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
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|About 10 Å/s to 250 Å/s
|About 10 Å/s to 250 Å/s


|-style="background:WhiteSmoke; color:black"
! Batch size
|
*Up to 1x4" wafers
*smaller pieces
|
*24x2" wafers or
*6x4" wafers or
*6x6" wafers
|
*12x2" wafers or
*12x4" wafers or
*4x6" wafers
|
*1x2" wafer or
*1x4" wafer or
*1x6" wafer
|-


|-style="background:WhiteSmoke; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials


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|-
|-
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:WhiteSmoke; color:black"
! Comment
! Comment
| Thicknesses above 2000 Å requires special permission
| Thicknesses above 2000 Å requires special permission
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