Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions
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! Layer thickness | ! Layer thickness | ||
|10Å to 0.5 µm | |10Å to 0.5 µm* | ||
|10Å to 500 Å | |10Å to 500 Å | ||
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'''*''' ''For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.'' | |||
Revision as of 13:12, 7 March 2014
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Molybdenum deposition
Molybdenum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. In PVD co-sputter/evaporation only VERY thin layers of Mo can be deposited.
| E-beam evaporation (Alcatel) | E-beam evaporation (PVD co-sputter/evaporation) | |
|---|---|---|
| Batch size |
|
|
| Pre-clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 0.5 µm* | 10Å to 500 Å |
| Deposition rate | 2Å/s to 15Å/s | About 1 Å/s |
| Allowed materials |
|
|
| Comment | Only very thin layers (up to 100nm). |
* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.