Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

@@ Line 15: / Line 15: @@
 |-
 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+|E-beam deposition of Chromium
-*Up to 1x4" wafers
+|E-beam deposition of Chromium
-*smaller pieces
+|E-beam deposition of Chromium
-|
+|Sputter deposition of Chromium
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
-|
-*12x2" wafers or
-*12x4" wafers or
-*4x6" wafers
-|
-*24x2" wafers or
-*6x4" wafers or
-*6x6" wafers
 |-
 |-style="background:LightGrey; color:black"
@@ Line 52: / Line 41: @@
 |About 1Å/s
 |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]]
+|-
+|-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*12x2" wafers or
+*12x4" wafers or
+*4x6" wafers
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|-
+|-style="background:LightGrey; color:black"
+! Allowed substrates
+|
+* Silicon wafers
+* Quartz wafers
+* Pyrex wafers
+|
+* Silicon wafers
+* Quartz wafers
+* Pyrex wafers
+|
+* Silicon wafers
+* Quartz wafers
+* Pyrex wafers
+|
+* Silicon wafers
+* Quartz wafers
+* Pyrex wafers
 |-
 |-style="background:WhiteSmoke; color:black"