Specific Process Knowledge/Wafer cleaning: Difference between revisions
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!Purpose | !Purpose | ||
|Mandatory prior furnace processes | |Mandatory prior furnace processes | ||
|When needed and always after KOH etch and Nitride etch in Phosphoric acid | |When needed and always after KOH etch and Nitride etch in Phosphoric acid. Sometimes mandatory before next processing step. | ||
|Optional during RCA cleaning | |Optional during RCA cleaning | ||
| | |Recommended cleaning and treatment before wafer bonding | ||
| | |Mandatory cleaning of very dirty items that enters the cleanroom. Should always be followed by a piranha clean. | ||
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