Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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{| border="1" cellspacing="0" cellpadding=" | |||
{| border="1" cellspacing="0" cellpadding="3" | |||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
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! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]]) | ! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni]]) | ||
|- | |- | ||
| Batch size | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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|- | |- | ||
| Pre-clean | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|None | |None | ||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Layer thickness | |||
|10Å to 5000 Å* | |||
|10Å to 5000 Å | |10Å to 1 µm* | ||
|10Å to 1 µm | |||
|10Å to 1000 Å | |10Å to 1000 Å | ||
|A few µm to 1400 µm | |A few µm to 1400 µm | ||
|- | |||
|-style="background:LightGrey; color:black" | |||
! Deposition rate | |||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
| Thicknesses above 200 nm requires special permission | |||
| | | | ||
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | |||
*Thicknesses above 200 nm requires special permission | |||
|Only very thin layers (up to 100nm). | |Only very thin layers (up to 100nm). | ||
|Sample must be compatible with plating bath. Seed metal necessary. | |Sample must be compatible with plating bath. Seed metal necessary. | ||
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'''*''' ''To deposit layers thicker then 200 nm permission is required (contact Thin film group)'' | |||
Revision as of 13:11, 6 March 2014
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Nickel deposition
Nickel can be deposited by e-beam evaporation or electroplating. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Electroplating (Electroplating-Ni) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | None |
| Layer thickness | 10Å to 5000 Å* | 10Å to 1 µm* | 10Å to 1000 Å | A few µm to 1400 µm |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | About 10 to 250 Å/s |
| Comment | Thicknesses above 200 nm requires special permission |
|
Only very thin layers (up to 100nm). | Sample must be compatible with plating bath. Seed metal necessary. |
* To deposit layers thicker then 200 nm permission is required (contact Thin film group)