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Specific Process Knowledge/Thin film deposition/MVD: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
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*Spin coating and soft baking UV sensative resists
*FDTS coating of Si or SiO2 surfaces
*Spin coating SU8 resists
*Indirect O2 plasma treatment
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!style="background:silver; color:black;" align="center" width="60"|Resist
!style="background:silver; color:black;" align="center" width="60"|Vapor sources
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|style="background:LightGrey; color:black"|Line
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*1
* AZ5214E permanent line
*2
* AZ4562 manual dispense
*3
* SU8 resists manual dispense
*4
|style="background:WhiteSmoke; color:black"|Chemical
*Water
*FDTS (new source)
*FDTS (old source, contaminated line)
*Available (line probably contaminated)
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
|style="background:LightGrey; color:black"|Coating thickness
|style="background:LightGrey; color:black"|Contact angle
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* AZ5214E 1-4,2 µm
110° (water)
* AZ4526 6,2-10 µm
* SU8 resits 0,1-100 µm
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Chamber temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
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100 - 5000 rpm
35°C
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|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Chamber volume
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100 - 5000 rpm/s
Approx. 3 liters
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|style="background:LightGrey; color:black"|Hotplate temperature
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* changeable temperature from 20° to 200°
* SU8 must be bake out on SU8 dedicated hotplates
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
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* 50 mm wafers
1" to 8"
* 100 mm wafers
* 150 mm wafers
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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All cleanroom materials except III-V materials
All cleanroom materials
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|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
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1  
1 sample at a time
 
2 (possibly 4) 4" or 6" wafers may be processed simultaneously using cassettes
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