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The Molecular Vapor Deposition tool

The Applied Microstructures MVD 100 system deposits molecular films on surfaces. These films serve a wide range of purposes ranging from antistiction coatings of nanoimprint lithography stamps to protecting MEMS structures. At Danchip the MVD is an essential tool for nanoimprint lithography.

The user manual, user APV, and contact information can be found in LabManager

Process information

Equipment performance and process related parameters

Purpose		FDTS coating of Si or SiO2 surfaces Indirect O2 plasma treatment
Vapor sources	Line 1 2 3 4	Chemical Water FDTS (new source) FDTS (old source, contaminated line) Available (line probably contaminated)
Performance	Contact angle	110° (water)
Process parameters	Chamber temperature	35°C
Process parameters	Chamber volume	Approx. 3 liters
Substrates	Substrate size	1" to 8"
	Allowed materials	All cleanroom materials
	Batch	1 sample at a time 2 (possibly 4) 4" or 6" wafers may be processed simultaneously using cassettes

@@ Line 23: / Line 23: @@
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-*Spin coating and soft baking UV sensative resists
+*FDTS coating of Si or SiO2 surfaces
-*Spin coating SU8 resists
+*Indirect O2 plasma treatment
 |-
-!style="background:silver; color:black;" align="center" width="60"|Resist
+!style="background:silver; color:black;" align="center" width="60"|Vapor sources
-|style="background:LightGrey; color:black"|
+|style="background:LightGrey; color:black"|Line
-|style="background:WhiteSmoke; color:black" align="center"|
+*1
-* AZ5214E permanent line
+*2
-* AZ4562 manual dispense
+*3
-* SU8 resists manual dispense
+*4
+|style="background:WhiteSmoke; color:black"|Chemical
+*Water
+*FDTS (new source)
+*FDTS (old source, contaminated line)
+*Available (line probably contaminated)
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
-|style="background:LightGrey; color:black"|Coating thickness
+|style="background:LightGrey; color:black"|Contact angle
 |style="background:WhiteSmoke; color:black" align="center"|
-* AZ5214E 1-4,2 µm
+° (water)
-* AZ4526 6,2-10 µm
-* SU8 resits 0,1-100 µm
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
+!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
-|style="background:LightGrey; color:black"|Spin speed
+|style="background:LightGrey; color:black"|Chamber temperature
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-- 5000 rpm
+°C
 |-
-|style="background:LightGrey; color:black"|Spin acceleration
+|style="background:LightGrey; color:black"|Chamber volume
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-- 5000 rpm/s
+Approx. 3 liters
-|-
-|style="background:LightGrey; color:black"|Hotplate temperature
-|style="background:WhiteSmoke; color:black" align="center"|
-* changeable temperature from 20° to 200°
-* SU8 must be bake out on SU8 dedicated hotplates
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black"|Substrate size
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-* 50 mm wafers
+" to 8"
-* 100 mm wafers
-* 150 mm wafers
 |-
 | style="background:LightGrey; color:black"|Allowed materials
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
-All cleanroom materials except III-V materials
+All cleanroom materials
 |-
 |style="background:LightGrey; color:black"|Batch
 |style="background:WhiteSmoke; color:black" align="center" colspan="2"|
+sample at a time
+(possibly 4) 4" or 6" wafers may be processed simultaneously using cassettes
 |-
 |}
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