Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions

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*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]]


==A rough overview of the performance of Wordentec and some process related parameters==
== Overview of the performance of Wordentec and some process related parameters==


{| border="2" cellspacing="0" cellpadding="10"  
{| border="2" cellspacing="0" cellpadding="10"  
|-
|-
!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Deposition of metals||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Deposition of metals|
|style="background:WhiteSmoke; color:black"|
*E-beam evaporation
*E-beam evaporation
*Sputtering
*Sputtering
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|-
|-
!style="background:silver; color:black" align="left"|Performance
!style="background:silver; color:black" align="left"|Performance
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Film thickness|
|style="background:WhiteSmoke; color:black"|
*~10Å - 1µm
*~10Å - 1µm
|-
|-
|style="background:silver; color:black" |.||style="background:LightGrey; color:black"|Deposition rate||style="background:WhiteSmoke; color:black"|
|style="background:silver; color:black" |
|style="background:LightGrey; color:black"|Deposition rate
|style="background:WhiteSmoke; color:black"|
*~2.5Å/s - 15Å/s
*~2.5Å/s - 15Å/s
|-
|-
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*Less than 80 <sup>o</sup>C
*Less than 80 <sup>o</sup>C
|-
|-
|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Process pressure
|style="background:silver; color:black"|
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*~3x10<sup>-7</sup> - 4x10<sup>-6</sup> mbar
*~3x10<sup>-7</sup> - 4x10<sup>-6</sup> mbar
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*Deposition on one side of the substrate
*Deposition on one side of the substrate
|-
|-
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers
*Silicon wafers
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*Pyrex wafers
*Pyrex wafers
|-  
|-  
|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:silver; color:black"|
| style="background:LightGrey; color:black"|Material allowed on the substrate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon oxide
*Silicon oxide

Revision as of 14:32, 7 May 2008

Wordentec QCL 800

Wordendec: positioned in cleanroom 4 in the Wordentec room

The Wordentec is a machine for:

  • Deposition of metal through E-beam deposition
  • Deposition of metal through thermal evaporation
  • Deposition of materials through DC sputtering
  • Cleaning of samples before deposition through Argon RF sputter clean

The Wordentec is designed to deposit on 1-6 samples in sequence, samples of a size up to 6" in diameter. Adaptors exist for deposition on 2", 4" and 6" wafers, but deposition is possible on samples of almost any size and shape, as long as they do not exceed the size of a 6" substrate. The Wordentec supports either single sample deposition on each sample or batch deposition on six wafers in sequence. It is possible to freely combine processes from the machines different sources.

Process information

The metals available for E-beam evaporation and their standard deposition rates are:

Metal Deposition rate [Å/s]
Titanium (Ti) 10
Chromium (Cr) 10
Aluminium (Al) 10
Nickel (Ni) 10
Platinum (Pt) 10
Gold (Au) 10

Thermal evaporation materials

We currently only have Aluminium available to deposit through thermal evaporation

Sputter materials

It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC sputtering. The materials available currently are:

Overview of the performance of Wordentec and some process related parameters

Purpose Deposition of metals|
  • E-beam evaporation
  • Sputtering
  • Thermal evaporation
Performance Film thickness|
  • ~10Å - 1µm
Deposition rate
  • ~2.5Å/s - 15Å/s
Process parameter range Process Temperature
  • Less than 80 oC
Process pressure
  • ~3x10-7 - 4x10-6 mbar
Substrates Batch size
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • Deposition on one side of the substrate
Substrate material allowed
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Any metals
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