Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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| Layer thickness
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|10Å to 5000Å  
|10Å to 5000Å*
|10Å to 5000Å
|10Å to 5000Å*
|10Å to 5000Å
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'''*''' ''For thicknesses above 200 nm permission is required from Thin Film group.''

Revision as of 13:47, 7 March 2014

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Platinum deposition

Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) Sputter deposition (Lesker)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 1x4" wafer or
  • 1x6" wafer
  • smaller pieces
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10Å to 5000Å* 10Å to 5000Å* 10Å to 5000Å
Deposition rate 2Å/s to 15Å/s 10Å/s to 15Å/s ? Å/s to ? Å/s

* For thicknesses above 200 nm permission is required from Thin Film group.

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