Specific Process Knowledge/Etch/Etching of Bulk Glass/AOE etching of fused silica: Difference between revisions
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Line 44: | Line 44: | ||
*1300 W | *1300 W | ||
| | | | ||
* | *1100W | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|''Platen Power'' | |''Platen Power'' | ||
Line 52: | Line 52: | ||
*500 W | *500 W | ||
| | | | ||
* | *180W | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|''Platen temperature'' | |''Platen temperature'' | ||
Line 60: | Line 60: | ||
*60<sup>o</sup>C | *60<sup>o</sup>C | ||
| | | | ||
* | *60<sup>o</sup>C | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|''He flow'' | |''He flow'' | ||
Line 68: | Line 68: | ||
*300 sccm | *300 sccm | ||
| | | | ||
* | *0 sccm | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|''C<sub>4</sub>F<sub>8</sub> flow'' | |''C<sub>4</sub>F<sub>8</sub> flow'' | ||
Line 76: | Line 76: | ||
*18 sccm | *18 sccm | ||
| | | | ||
* | *40 sccm | ||
|-style="background:LightGrey; color:black" | |||
|''O<sub>2</sub> flow'' | |||
| | |||
*0 sccm | |||
| | |||
*0 sccm | |||
| | |||
*5 sccm | |||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
|''H<sub>2</sub> flow'' | |''H<sub>2</sub> flow'' | ||
Line 85: | Line 93: | ||
| | | | ||
* | * | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
|''Pressure'' | |''Pressure'' | ||
Line 92: | Line 101: | ||
*4 mTorr | *4 mTorr | ||
| | | | ||
* | *6 mTorr | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" |
Revision as of 15:49, 3 September 2013
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Comparison of masking materials and AOE processes etching fused silica