Specific Process Knowledge/Etch/Wet Silicon Oxide Etch (BHF): Difference between revisions
| Line 374: | Line 374: | ||
|No wafers with metal are allowed in this bath | |No wafers with metal are allowed in this bath | ||
|Wafers have to be cleaned in 7UP or RCA before further processing. | |Wafers have to be cleaned in 7UP or RCA before further processing. | ||
|Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. | |Only for wafers with phosphor glass or boron glass that comes directly from one of the furnaces in stack A. All other substrates and material are strictly forbidden to go into the tank. | ||
|None | |None | ||
|None | |None | ||