Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs: Difference between revisions

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== SPTS documents on hardware ==
 
[[Media:Pegasus_sheet_V8.pdf‎ |Hardware Information - Overview]].
 
[[Media:Pegasus_specification_v2.4.pdf|Hardware Information - Detailed]].
 
[[Media:Pegasus_System_Description_&_Differentiation.pdf|The Advantages the Pegasus has over existing Si etchers]].
 
[[Media:Macs_v2.pdf|Robot Handling System Information ]].
 
== Process applications ==
 
[[Media:Aerospace.pdf‎ |MEMS in Aerospace]].
 
[[Media:Bio-medical.pdf|Bio Medical]].
 
[[Media:Energy.pdf|MEMS in Energy]].
 
[[Media:Nanotechnology.pdf|Nanotechnology]].
 
[[Media:Packaging-etch.pdf‎ |Packaging Applications]].
 
[[Media:Appl-sheets-4_markets.pdf|General Applications]].
 
== Specifically for Pegasus tools ==
 
[[Media:SPTS High Flow Plenum Upgrade for Pegasus Nov 2012.pdf|High Flow Plenum Upgrade]]
 
[[Media:Claritas_February_2012.pdf|Claritas Endpoint Detection System]]

Latest revision as of 11:33, 28 June 2023

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